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Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters
นักวิจัย : Lim, Adeline B. Y. , Chang, Andrew C. K. , Yauw, Oranna , Chylak, Bob , Gan, Chee Lip , Chen, Zhong
คำค้น : DRNTU::Engineering::Materials::Electronic packaging materials
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2557
อ้างอิง : Lim, A. B., Chang, A. C., Yauw, O., Chylak, B., Gan, C. L., & Chen, Z. (2014). Ultra-fine pitch palladium-coated copper wire bonding: Effect of bonding parameters. Microelectronics reliability, 54(11), 2555-2563. , 0026-2714 , http://hdl.handle.net/10220/24289 , http://dx.doi.org/10.1016/j.microrel.2014.05.005
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Microelectronics reliability
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

Copper (Cu) wire bonding has become a mainstream IC assembly solution due to its significant cost savings over gold wire. However, concerns on corrosion susceptibility and package reliability have driven the industry to develop alternative materials. In recent years, palladium-coated copper (PdCu) wire has become widely used as it is believed to improve reliability. In this paper, we experimented with 0.6 ml PdCu and bare Cu wires. Palladium distribution and grain structure of the PdCu Free Air Ball (FAB) were investigated. It was observed that Electronic Flame Off (EFO) current and the cover gas type have a significant effect on palladium distribution in the FAB. The FAB hardness was measured and correlated to palladium distribution and grain structure. First bond process responses were characterized. The impact of palladium on wire bondability and wire bond intermetallic using a high temperature storage test was studied.

บรรณานุกรม :
Lim, Adeline B. Y. , Chang, Andrew C. K. , Yauw, Oranna , Chylak, Bob , Gan, Chee Lip , Chen, Zhong . (2557). Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Lim, Adeline B. Y. , Chang, Andrew C. K. , Yauw, Oranna , Chylak, Bob , Gan, Chee Lip , Chen, Zhong . 2557. "Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Lim, Adeline B. Y. , Chang, Andrew C. K. , Yauw, Oranna , Chylak, Bob , Gan, Chee Lip , Chen, Zhong . "Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2557. Print.
Lim, Adeline B. Y. , Chang, Andrew C. K. , Yauw, Oranna , Chylak, Bob , Gan, Chee Lip , Chen, Zhong . Ultra-fine pitch palladium-coated copper wire bonding : effect of bonding parameters. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2557.