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Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability
นักวิจัย : Yang, Ying , Balaraju, J. N. , Huang, Yizhong , Liu, Hai , Chen, Zhong
คำค้น : DRNTU::Engineering::Materials::Electronic packaging materials
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2557
อ้างอิง : Yang, Y., Balaraju, J., Huang, Y., Liu, H., & Chen, Z. (2014). Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability. Acta Materialia, 71, 69-79. , 1359-6454 , http://hdl.handle.net/10220/20248 , http://dx.doi.org/10.1016/j.actamat.2014.02.026
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Acta Materialia
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

To address the reliability challenges brought by the accelerated reaction with the implementation of lead-free solders, an electrolessly plated Ni-Co-P alloy (3~4 wt.% P and 9~12 wt.% Co) was developed as the solder metallization in this study. Three compounds layers, (Ni,Co)3Sn4, (Ni,Co)3P and (Ni,Co)12P5 are formed at the reaction interface. Nano-sized voids are visible in the (Ni,Co)3P layer under TEM, but no large voids are found under SEM. This is an indication of effective diffusion barrier performance by the Ni-Co-P metallization than the binary Ni-P metallization. The influence of interfacial reaction on the solder joint reliability was reported through the evaluation of the tensile strength of micro solder joints. Upon aging at 180 C for 600 h, the tensile strength of Ni-Co-P/Sn-3.5Ag solder joint remains high, and the failure is caused by the bulk solder necking and collapse. As a comparison, the tensile strength of Ni-P/Sn-3.5Ag solder joint drops significantly after aging for 400 h at 180 C, and the fracture mode has shifted from ductile failure in the bulk solder to the brittle failure at the solder joint interface. The Ni-Co-P metallization, having a much slower consumption rate and improved resistance to joint strength degradation during long-term aging treatment, is a potential candidate for future microelectronic solder metallization materials.

บรรณานุกรม :
Yang, Ying , Balaraju, J. N. , Huang, Yizhong , Liu, Hai , Chen, Zhong . (2557). Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Yang, Ying , Balaraju, J. N. , Huang, Yizhong , Liu, Hai , Chen, Zhong . 2557. "Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Yang, Ying , Balaraju, J. N. , Huang, Yizhong , Liu, Hai , Chen, Zhong . "Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2557. Print.
Yang, Ying , Balaraju, J. N. , Huang, Yizhong , Liu, Hai , Chen, Zhong . Interface reaction between an electroless Ni–Co–P metallization and Sn–3.5Ag lead-free solder with improved joint reliability. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2557.