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Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief
นักวิจัย : Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng
คำค้น : DRNTU::Engineering::Electrical and electronic engineering.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2555
อ้างอิง : Ghosh, K., Zhang, J., Zhang, L., Dong, Y., Li, H., Tan, C. M., Xia, G.,& Tan, C. S. (2012). Integration of Low-κ Dielectric Liner in Through Silicon Via and Thermomechanical Stress Relief. Applied Physics Express, 5(12), 126601-. , http://hdl.handle.net/10220/12600 , http://dx.doi.org/10.1143/APEX.5.126601
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Applied physics express
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

Through silicon via (TSV) consists of a copper (Cu) core isolated by a dielectric liner. The thermomechanical stress originating from the mismatch in the coefficient of thermal expansion of Cu and silicon is a serious concern on mechanical reliability and electrical variability. The effect on thermomechanical stress by replacing the conventional liner (silicon dioxide) with a low-κ liner (carbon-doped silicon dioxide) is studied. By micro-Raman analysis, it is observed that the biaxial stress in silicon at the immediate vicinity of Cu-TSV is relieved by 29–45% with a low-κ liner due to its smaller elastic modulus.

บรรณานุกรม :
Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . (2555). Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . 2555. "Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . "Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2555. Print.
Ghosh, Kaushik , Zhang, Jiye , Zhang, Lin , Dong, Yuanwei , Li, Hong Yu , Tan, Cher Ming , Xia, Guangrui , Tan, Chuan Seng . Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2555.