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Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress
นักวิจัย : Lim, Meng Keong , Lin, Jingyuan , Ee, Elden Yong Chiang , Ng, Chee Mang , Wei, Jun , Gan, Chee Lip
คำค้น : DRNTU::Engineering::Materials.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2554
อ้างอิง : http://hdl.handle.net/10220/11237 , http://dx.doi.org/10.1016/j.microrel.2011.12.026
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Microelectronics reliability
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The electromigration behaviour of Cu/SiCOH interconnects carrying unipolar pulsed current with long periods (i.e. 2, 16, 32 and 48 h) is presented in this study. Experimental observations suggest that the electromigration behaviour during void growth can be described by the ON-time model and that the lifetime of the Cu/SiCOH interconnects is inversely related to the duty cycle. Numerical simulation is carried out to compute the time required to nucleate a void under unipolar pulsed current stress conditions. The time to void nucleation is found to vary proportionally to the inverse square of the duty cycle and is independent of frequency at 1 Hz and higher. By computing the stress evolution in interconnects with short length, it was shown that the product of the unipolar pulsed current’s duty cycle and current density, i.e. average current density, is equivalent to the current density of a constant current (D.C.) stress. The simulation results suggest (d · jL)crit as the equivalent critical current density-length product under unipolar pulsed current condition. Both the experimental and simulation results show that duty cycle has an effect on the electromigration lifetime of interconnects carrying unipolar pulsed current.

บรรณานุกรม :
Lim, Meng Keong , Lin, Jingyuan , Ee, Elden Yong Chiang , Ng, Chee Mang , Wei, Jun , Gan, Chee Lip . (2554). Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Lim, Meng Keong , Lin, Jingyuan , Ee, Elden Yong Chiang , Ng, Chee Mang , Wei, Jun , Gan, Chee Lip . 2554. "Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Lim, Meng Keong , Lin, Jingyuan , Ee, Elden Yong Chiang , Ng, Chee Mang , Wei, Jun , Gan, Chee Lip . "Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2554. Print.
Lim, Meng Keong , Lin, Jingyuan , Ee, Elden Yong Chiang , Ng, Chee Mang , Wei, Jun , Gan, Chee Lip . Experimental characterization and modelling of electromigration lifetime under unipolar pulsed current stress. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2554.