ridm@nrct.go.th   ระบบคลังข้อมูลงานวิจัยไทย   รายการโปรดที่คุณเลือกไว้

Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
นักวิจัย : Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C.
คำค้น : DRNTU::Engineering::Electrical and electronic engineering::Microelectronics.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2554
อ้างอิง : http://hdl.handle.net/10220/11241 , http://dx.doi.org/10.1016/j.microrel.2011.04.003
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Microelectronics reliability
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

Self-assembled monolayer (SAM) of alkane-thiol is formed on copper (Cu) thin layer coated on silicon (Si) wafer with the aim to protect the surface against excessive oxidation during storage in the room ambient. After 3 days of storage, the temporary SAM layer is desorbed with in situ anneal in inert ambient to uncover the clean Cu surface. A pair of wafers is bonded at 250 °C. Clear evidences of in-plane and out-of-plane Cu grain growth are observed resulting in a wiggling bonding interface. This gives rise to enhancement in shear strength in the bonded Cusingle bondCu layer.

บรรณานุกรม :
Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . (2554). Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . 2554. "Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . "Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2554. Print.
Tan, Chuan Seng , Lim, Dau Fatt , Ang, X. F. , Wei, J. , Leong, K. C. . Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2554.