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Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits
นักวิจัย : Made, Riko I. , Peng, Lan , Li, Hong Yu , Gan, Chee Lip , Tan, Chuan Seng
คำค้น : DRNTU::Engineering::Materials::Metallic materials::Alloys.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2556
อ้างอิง : Made, R. I., Lan, P., Li, H. Y., Gan, C. L., & Tan, C. S. (2013). Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits. Microelectronic Engineering, 106, 149-154. , http://hdl.handle.net/10220/9997 , http://dx.doi.org.ezlibproxy1.ntu.edu.sg/10.1016/j.mee.2013.01.020 , 172744
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Microelectronic engineering
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The ability to be used as both a glue layer and the interconnection line has put Cu metal interconnection as the ultimate goal for 3D-IC. However, the inherent properties of Cu–Cu bond interface that are not always perfect have raised some concerns. This work investigates the evolution of the Cu–Cu bond interface that had been subjected to prolonged electrical current stress. Interface evolutions were characterized by a combination of electrical current stressing and bond interface cross-sectional analysis. While interface improvement was observed in terms of interface void reduction after current stressing, early failures to the interconnection line adjacent to the bond interface were observed. Electromigration had driven void migration from the large bond interface area to the much smaller adjoining interconnect line. This potentially has a significant impact on the future of 3D-IC technology that utilizes Cu–Cu bonding. However, this problem can be mitigated by inserting a barrier layer in between the bond interface and the interconnect line to prevent the migration of the voids into the interconnect line

บรรณานุกรม :
Made, Riko I. , Peng, Lan , Li, Hong Yu , Gan, Chee Lip , Tan, Chuan Seng . (2556). Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Made, Riko I. , Peng, Lan , Li, Hong Yu , Gan, Chee Lip , Tan, Chuan Seng . 2556. "Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Made, Riko I. , Peng, Lan , Li, Hong Yu , Gan, Chee Lip , Tan, Chuan Seng . "Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2556. Print.
Made, Riko I. , Peng, Lan , Li, Hong Yu , Gan, Chee Lip , Tan, Chuan Seng . Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2556.