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Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity
นักวิจัย : Yu, Hao , Ho, Joanna , He, Lei
คำค้น : DRNTU::Engineering::Electrical and electronic engineering.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2552
อ้างอิง : Yu, H., Ho, J., & He, L. (2009). Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. ACM Transactions on Design Automation of Electronic Systems, 14(3). , 1084-4309 , http://hdl.handle.net/10220/8745 , http://dx.doi.org/10.1145/1529255.1529263 , 148332
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : ACM transactions on design automation of electronic systems
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The existing work on via allocation in 3D ICs ignores power/ground vias’ ability to simultaneously reduce voltage bounce and remove heat. This paper develops the first in-depth study on the allocation of power/ground vias in 3D ICs with simultaneous consideration of power and thermal integrity. By identifying principal ports and parameters, effective electrical and thermal macromodels are employed to provide dynamic power and thermal integrity as well as sensitivity with respect to via density. With the use of sensitivity, an efficient via allocation simultaneously driven by power and thermal integrity is developed. Experiments show that compared to sequential power and thermal optimization using static integrity, sequential optimization using the dynamic integrity reduces non-signal vias by up to 18%, and simultaneous optimization using dynamic integrity further reduces non-signal vias by up to 45.5%.

บรรณานุกรม :
Yu, Hao , Ho, Joanna , He, Lei . (2552). Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Yu, Hao , Ho, Joanna , He, Lei . 2552. "Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Yu, Hao , Ho, Joanna , He, Lei . "Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2552. Print.
Yu, Hao , Ho, Joanna , He, Lei . Allocating power ground vias in 3D ICs for simultaneous power and thermal integrity. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2552.