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Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization
นักวิจัย : He, Min , Chen, Zhong , Qi, Guojun , Wong, Chee C. , Mhaisalkar, Subodh Gautam
คำค้น : DRNTU::Engineering::Materials
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2547
อ้างอิง : He, M., Chen, Z., Qi, G., Wong, C. C., & Mhaisalkar, S. G. (2004). Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization. Thin solid films, 462-463, 363-369. , http://hdl.handle.net/10220/8155 , http://dx.doi.org/10.1016/j.tsf.2004.05.045
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Thin solid films
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

Cooling rate is an important parameter in solder reflow process because it influences not only microstructure of solder alloy but also the morphology and growth of intermetallic compounds (IMC) formed between solder and its metallization. All these ultimately affect the mechanical integrity of the joint. In this work, the effect of cooling rate on IMC growth is studied in Sn–3.5 Ag solder/Ni–P under bump metallization (UBM) system. Morphology and growth kinetics of the formed Ni3Sn4 IMC under different cooling rates are studied. Needle-type, boomerang-type and chunk-type of Ni3Sn4 IMCs have been observed between solder and Ni–P UBM under various cooling conditions. The amount of the needle-type and boomerang-type grains decreases with the increase of reflow time. Prolonged reflow results in continuous layer of chunk-type IMC grains with no obvious effect from the cooling rate. Samples with different post-reflow cooling rate are further annealed. It is found that the IMC layer thickness increases faster in samples under fast cooling rate than the slow ones under the same annealing condition.

บรรณานุกรม :
He, Min , Chen, Zhong , Qi, Guojun , Wong, Chee C. , Mhaisalkar, Subodh Gautam . (2547). Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
He, Min , Chen, Zhong , Qi, Guojun , Wong, Chee C. , Mhaisalkar, Subodh Gautam . 2547. "Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
He, Min , Chen, Zhong , Qi, Guojun , Wong, Chee C. , Mhaisalkar, Subodh Gautam . "Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2547. Print.
He, Min , Chen, Zhong , Qi, Guojun , Wong, Chee C. , Mhaisalkar, Subodh Gautam . Effect of post-reflow cooling rate on intermetallic compound formation between Sn–3.5 Ag solder and Ni–P under bump metallization. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2547.