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The strength of the silicon die in flip-chip assemblies

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : The strength of the silicon die in flip-chip assemblies
นักวิจัย : Cotterell, Brian , Chen, Z. , Han, J. B. , Tan, N. X.
คำค้น : DRNTU::Engineering::Materials
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2546
อ้างอิง : Cotterell, B., Chen, Z., Han, J. B., & Tan, N. X. (2003). The Strength of the Silicon Die in Flip Chip Assemblies. Journal of Electronic Packaging, 125(1), 114-119. , http://hdl.handle.net/10220/7710 , http://dx.doi.org/10.1115/1.1535934
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Journal of electronic packaging
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The mechanical reliability of silicon dies is affected by the defects introduced by surface grinding and edge dicing. The ring-on-ring and the four-point-bend test have been used in this study to separate the distribution in strength for these two types of defect. At low probabilities of failure, it is the "strength" of the edge defects that dominate the reliability. However, if the edges of the die are only lightly stressed compared with the surface, edge defects are unlikely to cause fracture. In this case the use of the four-point-bend test, which is sensitive to both edge and surface defects, will result in an underestimate of the reliability and if only one test is to be performed the ring-on-ring test is preferable to the four-point-bend test. Generally, for a full reliability estimate, the distributions of both types of defect need to be determined.

บรรณานุกรม :
Cotterell, Brian , Chen, Z. , Han, J. B. , Tan, N. X. . (2546). The strength of the silicon die in flip-chip assemblies.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Cotterell, Brian , Chen, Z. , Han, J. B. , Tan, N. X. . 2546. "The strength of the silicon die in flip-chip assemblies".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Cotterell, Brian , Chen, Z. , Han, J. B. , Tan, N. X. . "The strength of the silicon die in flip-chip assemblies."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2546. Print.
Cotterell, Brian , Chen, Z. , Han, J. B. , Tan, N. X. . The strength of the silicon die in flip-chip assemblies. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2546.