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Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications
นักวิจัย : Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo
คำค้น : DRNTU::Engineering::Materials::Electronic packaging materials , DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Thin films
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2552
อ้างอิง : Made, R. I., Gan, C. L., Yan, L. L., Yu, A., Yoon, S. W., Lau, J. H., et al. (2009). Study of Low-Temperature Thermocompression Bonding in Ag-In Solder for Packaging Applications. Journal of Electronic Materials, 38, 365-371. , 0361-5235 , http://hdl.handle.net/10220/7261 , http://dx.doi.org/10.1007/s11664-008-0555-8 , 142282
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Journal of electronic materials
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

Low-temperature solders have wide applications in integrated circuits and micro-electromechanical systems packaging. In this article, a study on Ag-In solder for chip-to-chip thermocompression bonding was carried out. The resulting joint consists of AgIn2 and Ag9In4 phases, with the latter phase having a melting temperature higher than 400 C. Complete consumption of In solder into a Ag-rich intermetallic compound is achieved by applying a bond pressure of 1.4 MPa at 180 C for 40 min. We also observe that the bonding pressure effect enables a Ag-rich phase to be formed within a shorter bonding duration (10 min) at a higher pressure of 1.6 MPa. Finally, prolonged aging leads to the formation of the final phase of Ag9In4 in the bonded joints.

บรรณานุกรม :
Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . (2552). Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . 2552. "Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . "Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2552. Print.
Made, Riko I. , Gan, Chee Lip , Yan, Li Ling , Yu, Aibin , Yoon, Seung Wook , Lau, John H. , Lee, Chengkuo . Study of low-temperature thermocompression bonding in Ag-In solder for packaging applications. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2552.