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Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects
นักวิจัย : Ang, Derrick , Ramanujan, Raju V.
คำค้น : DRNTU::Engineering::Materials::Microelectronics and semiconductor materials::Nanoelectronics and interconnects
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2549
อ้างอิง : Ang, D., & Ramanujan, R. V. (2006). Hydrostatic Stress and Hydrostatic Stress Gradients in Passivated Copper Interconnects. Materials Science and Engineering: A, 423, 157-165. , 0921-5093 , http://hdl.handle.net/10220/7255 , http://dx.doi.org/10.1016/j.msea.2005.10.079 , 143647
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : Materials science and engineering: A
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

A numerical evaluation of the effects of geometrical factors on the hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects was performed. These values were correlated with experimental values in the literature on the location of voids in the interconnect. Copper interconnects of aspect ratios between 0.1 and 10 were studied. Numerical work using the commercial ANSYS software and analytical work based on the Eshelby andWikstr¨om models were performed. Comparison is made between the analytical, numerical and experimental results (obtained from the literature). It was found that for an interconnect with no pre-existing voids, maximum hydrostatic stress gradients occurred at the corners of the interconnects suggesting that void growth is most probable at the corners of the interconnect. The stress gradient within the interconnect with aspect ratio of 10 is about 10 times larger than that in interconnects of aspect ratios 0.1 and 1. This suggests that the narrowest interconnects are most likely to undergo voiding. This study found that it is insufficient to look only at the hydrostatic stress at the centre of the interconnect and that stress gradient also needs to be taken into consideration to assess reliability.

บรรณานุกรม :
Ang, Derrick , Ramanujan, Raju V. . (2549). Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Ang, Derrick , Ramanujan, Raju V. . 2549. "Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Ang, Derrick , Ramanujan, Raju V. . "Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2549. Print.
Ang, Derrick , Ramanujan, Raju V. . Hydrostatic stress and hydrostatic stress gradients in passivated copper interconnects. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2549.