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Statistical modeling of via redundancy effects on interconnect reliability

หน่วยงาน Nanyang Technological University, Singapore

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ชื่อเรื่อง : Statistical modeling of via redundancy effects on interconnect reliability
นักวิจัย : Raghavan, Nagarajan , Tan, Cher Ming
คำค้น : DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2551
อ้างอิง : Raghavan, N., & Tan, C. M. (2008). Statistical modeling of via redundancy effects on interconnect reliability. International Symposium on the Physical and Failure Analysis of Integrated Circuits (pp.1-5) Singapore. , http://hdl.handle.net/10220/6345 , http://dx.doi.org/10.1109/IPFA.2008.4588156
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : -
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

Electromigration is an important failure mechanism in the nano-interconnects of modern IC technology. Various approaches have been investigated to prolong the lifetime of an interconnect. One such approach is to have an in-built redundancy in the via structures of the interconnect. The presence of redundant via in a parallel topology helps improve the overall reliability of the via structure. Although reliability improvement due to via redundancy is qualitatively understood, it is necessary to quantify the improvement in reliability through statistical models so that the improvement in lifetime as a result of redundancy can be quantified. A statistical model that incorporates the effects of redundancy is developed in this study and it is used to estimate the reliability of redundant via structures. The Cumulative Damage Model (CDM) is used in conjunction with the Maximum Likelihood Estimate (MLE) method to assess the reliability of load sharing via redundant structures in this study.

บรรณานุกรม :
Raghavan, Nagarajan , Tan, Cher Ming . (2551). Statistical modeling of via redundancy effects on interconnect reliability.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Raghavan, Nagarajan , Tan, Cher Ming . 2551. "Statistical modeling of via redundancy effects on interconnect reliability".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Raghavan, Nagarajan , Tan, Cher Ming . "Statistical modeling of via redundancy effects on interconnect reliability."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2551. Print.
Raghavan, Nagarajan , Tan, Cher Ming . Statistical modeling of via redundancy effects on interconnect reliability. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2551.