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A new creep model for SnAgCu lead-free composite solders : incorporating back stress

หน่วยงาน Nanyang Technological University, Singapore

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ชื่อเรื่อง : A new creep model for SnAgCu lead-free composite solders : incorporating back stress
นักวิจัย : Jing, Hongyang , Nai, S. M. L. , Tan, Cher Ming , Xu, L. Y. , Zhang, S. R. , Wei, Jun , Han, Yongdian
คำค้น : DRNTU::Engineering::Electrical and electronic engineering::Electronic apparatus and materials.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2551
อ้างอิง : Jing, H., Nai, S. M. L., Tan, C. M., Xu, L. Y., Zhang, S. R., Wei, J., et al. (2008). A new creep model for SnAgCu lead-free composite solders : incorporating back stress. In proceedings of the 10th Electronics Packaging Technology Conference: Singapore, (pp.689-695). , http://hdl.handle.net/10220/6383 , http://dx.doi.org/10.1109/EPTC.2008.4763513
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : -
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The paper presents improved constitutive models for SnAgCu solder. In the present study, the constitutive behavior for creep performance of 95.8Sn-3.5Ag-0.7Cu lead-free solder was investigated. The secondary creep stage was focused on. It is shown that the stress exponent n can be well-defined into two stress regimes: low stress and high stress. A new constitutive model, which considered back stress, is proposed to describe the creep behavior of SnAgCu solder. In this model, back stress, being a function of applied shear stress in the low stress regime and particle size, volume fraction, coarsening of IMC particles in high stress regime, is introduced to construct the relationship between the creep strain rate and shear stress. The creep mechanism in these two stress regimes was studied in detail. In low stress regime, dislocations pass through the matrix by climbing over IMC particles. While in high stress one, dislocations are glide-controlled. According to the different creep mechanisms in both stress regimes, the back stress was calculated respectively and then incorporated into Arrhenius power-law creep model. It is demonstrated that the predicted strain rate-shear stress behavior employing the modified creep constitutive model considering back stress is consistent well with the experimental results.

บรรณานุกรม :
Jing, Hongyang , Nai, S. M. L. , Tan, Cher Ming , Xu, L. Y. , Zhang, S. R. , Wei, Jun , Han, Yongdian . (2551). A new creep model for SnAgCu lead-free composite solders : incorporating back stress.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Jing, Hongyang , Nai, S. M. L. , Tan, Cher Ming , Xu, L. Y. , Zhang, S. R. , Wei, Jun , Han, Yongdian . 2551. "A new creep model for SnAgCu lead-free composite solders : incorporating back stress".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Jing, Hongyang , Nai, S. M. L. , Tan, Cher Ming , Xu, L. Y. , Zhang, S. R. , Wei, Jun , Han, Yongdian . "A new creep model for SnAgCu lead-free composite solders : incorporating back stress."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2551. Print.
Jing, Hongyang , Nai, S. M. L. , Tan, Cher Ming , Xu, L. Y. , Zhang, S. R. , Wei, Jun , Han, Yongdian . A new creep model for SnAgCu lead-free composite solders : incorporating back stress. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2551.