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Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power
นักวิจัย : Yu, Hao , Shi, Yiyu , He, Lei , Karnik, Tanay
คำค้น : DRNTU::Engineering::Electrical and electronic engineering::Integrated circuits.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2551
อ้างอิง : Yu, H., Shi, Y., He, L., & Karnik, T. (2008). Thermal via allocation for 3D ICs considering temporally and spatially variant thermal power. IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 16(12), 1609-1619. , 1063-8210 , http://hdl.handle.net/10220/6262 , http://dx.doi.org/10.1109/TVLSI.2008.2001297 , 148333
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : IEEE transactions on very large scale integration (VLSI) systems
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The existing 3-D thermal-via allocation methods are based on the steady-state thermal analysis and may lead to excessive number of thermal vias. This paper develops an accurate and efficient thermal-via allocation considering the temporally and spatially variant thermal-power. The transient temperature is calculated by macromodel with a one-time structured and parameterized model reduction, which also generates temperature sensitivity with respect to thermal-via density. The proposed thermal-via allocation minimizes the time-integral of temperature violation, and is solved by a sequential quadratic programming algorithm with use of sensitivities from the macromodel. Compared to the existing method using the steady-state thermal analysis, our method in experiments is 126x faster to obtain temperature, and reduces the number of thermal vias by 2.04x under the same temperature bound.

บรรณานุกรม :
Yu, Hao , Shi, Yiyu , He, Lei , Karnik, Tanay . (2551). Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Yu, Hao , Shi, Yiyu , He, Lei , Karnik, Tanay . 2551. "Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Yu, Hao , Shi, Yiyu , He, Lei , Karnik, Tanay . "Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2551. Print.
Yu, Hao , Shi, Yiyu , He, Lei , Karnik, Tanay . Thermal via allocation for 3-D ICs considering temporally and spatially variant thermal power. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2551.