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Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios
นักวิจัย : Zhang, Yue Ping , Wai, L. L. , Chua, Kai Meng , Sun, Mei , Liu, Duixian
คำค้น : DRNTU::Engineering::Electrical and electronic engineering.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2552
อ้างอิง : Zhang, Y. P., Wai, L. L., Chua, K. M., Sun, M., & Liu, D. (2009). Antenna-in-package design for wirebond interconnection to highly-integrated 60-GHz radios. IEEE Transactions on Antennas and Propagation. 57(10), 2842-2852. , 0018-926X , http://hdl.handle.net/10220/6267 , http://dx.doi.org/10.1109/TAP.2009.2029290
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : IEEE transactions on antennas and propagation
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

This paper first presents a quasi-cavity-backed, guard-ring-directed, substrate-material-modulated slot antenna. The antenna, intended for use in highly integrated 60-GHz radios, is deliberately designed to exhibit capacitive input impedance to suit low-cost wire-bonding packaging and assembly technique. The antenna implemented in a thin cavity-down ceramic ball grid array (CBGA) package in low-temperature cofired ceramic(LTCC) technology has achieved an acceptable impedance bandwidth from 59 to 65 GHz with an estimated efficiency of 94%. At millimeter-wave (mm-wave) frequency 60 GHz, one of key challenges is how to realize low-loss interconnection between a radio chip and an antenna using wire-bonding technique. This paper then addresses this issue in the framework of antenna-in-package (AiP) design at 60 GHz and proposes a new solution to the challenge. Detailed wirebond design method and results are given. A major concern with AiP is the risk of the antenna coupling to the radio chip. This paper also evaluates this unwanted coupling and shows that the coupling from the in-package antenna to the on-chip inductor is lower than 30 dB for the worst case. These results clearly demonstrate the feasibility and promise of the elegant AiP technology for emerging high-speed short-range 60-GHz wireless communications.

บรรณานุกรม :
Zhang, Yue Ping , Wai, L. L. , Chua, Kai Meng , Sun, Mei , Liu, Duixian . (2552). Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Zhang, Yue Ping , Wai, L. L. , Chua, Kai Meng , Sun, Mei , Liu, Duixian . 2552. "Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Zhang, Yue Ping , Wai, L. L. , Chua, Kai Meng , Sun, Mei , Liu, Duixian . "Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2552. Print.
Zhang, Yue Ping , Wai, L. L. , Chua, Kai Meng , Sun, Mei , Liu, Duixian . Antenna-in-package design for wirebond interconnection to highly integrated 60-GHz radios. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2552.