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Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers

หน่วยงาน Nanyang Technological University, Singapore

รายละเอียด

ชื่อเรื่อง : Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers
นักวิจัย : Wang, Jun Jun , Zhang, Yue Ping , Chua, Kai Meng , Lu, Albert Chee Wai
คำค้น : DRNTU::Engineering::Electrical and electronic engineering.
หน่วยงาน : Nanyang Technological University, Singapore
ผู้ร่วมงาน : -
ปีพิมพ์ : 2548
อ้างอิง : Wang, J. J., Zhang, Y. P., Chua, K. M., & Lu, A. C. W. (2005). Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers. IEEE Transactions on Antennas and Propagation, 53(12), 3877-3883. , 0018-926X , http://hdl.handle.net/10220/4649
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : IEEE transactions on antennas and propagation
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

This paper presents the circuit model of a microstrip patch antenna on a ceramic land grid array (CLGA) package for the antenna-chip codesign of a highly integrated radio-frequency (RF) transceiver. The microstrip patch antenna is fed by packaging interconnect components such as bond wires, signal traces, and vias in a ground-signal-ground (G-S-G) configuration from the carried chip. The circuit model that consists of RLC lumped elements of both microstrip patch antenna and feeding interconnect components has been developed with an emphasis on verifying existing or deriving analytical formulas. The RLC values of the microstrip patch antenna are calculated with our improvements to existing computer-aided design formulas, while the RLC values of the feeding interconnect components are calculated with more efforts. In particular the C values related to the vias and signal traces require to be calculated numerically and they are calculated here with the method of moments and the conformal mapping method, respectively. The circuit model is validated with numerical simulations (High Frequency Structure Simulator) and network analyzer measurements.

บรรณานุกรม :
Wang, Jun Jun , Zhang, Yue Ping , Chua, Kai Meng , Lu, Albert Chee Wai . (2548). Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers.
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Wang, Jun Jun , Zhang, Yue Ping , Chua, Kai Meng , Lu, Albert Chee Wai . 2548. "Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers".
    กรุงเทพมหานคร : Nanyang Technological University, Singapore.
Wang, Jun Jun , Zhang, Yue Ping , Chua, Kai Meng , Lu, Albert Chee Wai . "Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers."
    กรุงเทพมหานคร : Nanyang Technological University, Singapore, 2548. Print.
Wang, Jun Jun , Zhang, Yue Ping , Chua, Kai Meng , Lu, Albert Chee Wai . Circuit model of microstrip patch antenna on ceramic land grid array package for antenna-chip codesign of highly integrated RF transceivers. กรุงเทพมหานคร : Nanyang Technological University, Singapore; 2548.