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Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages

หน่วยงาน Universiti Sains Malaysia, Malaysia

รายละเอียด

ชื่อเรื่อง : Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages
นักวิจัย : Lim, Chong Hooi
คำค้น : T Technology , TJ1-1570 Mechanical engineering and machinery
หน่วยงาน : Universiti Sains Malaysia, Malaysia
ผู้ร่วมงาน : -
ปีพิมพ์ : 2560
อ้างอิง : http://eprints.usm.my/46933/1/Heat%20Transfer%20And%20Deformation%20Of%20Flexible%20Printed%20Circuit%20Board%20With%20Multi%20Ball%20Grid%20Array%20Packages.pdf , Lim, Chong Hooi (2017) Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages. PhD thesis, Universiti Sains Malaysia.
ที่มา : -
ความเชี่ยวชาญ : -
ความสัมพันธ์ : http://eprints.usm.my/46933/ , http://irplus.eng.usm.my/irstore/checkdoclogin.php?id=QTNGV2xEQWFVRVNzdGprYzlhaWt0Zz09
ขอบเขตของเนื้อหา : -
บทคัดย่อ/คำอธิบาย :

The rapid development of electronic and microelectronic technology increases the demands for electronics device with flexible and light weight capability. Flexible printed circuit board (FPCB) which can be used to replace rigid printed circuit board (RPCB) is well equipped with those features. However, the soft feature of FPCB poses unwanted deflection (δ) and stress from the flow and heat generated by the operating components. In present research, thermal and flow effects on FPCB with attached ball grid array (BGA) packages have been investigated where the numerical simulation with coupled of flow and thermal effects concurrently has been successfully developed in the simulation. The effects of flow are studied at the initial stage of the research, followed by the addition of heat source to the BGA packages. The experimental work with actual attached ball grid array (BGA) packages was carried out to verify and validate the results. Findings show that better heat transfer performance on FPCB with an average 24 % higher than RPCB. Several parametric factors are explored including flow velocities (v) (1 – 5 m/s), 1 - 4 number of BGA packages attached, power supplied to the BGA packages (0 – 0.213 W), size of FPCB (80mm2 – 140mm2) and distance between BGA packages (15 mm – 45 mm). The heat transfer coefficient (h) has been added into the responses to study the heat transfer in the cases that involved heat source. Later on, v, δ and h had been normalized into dimensionless Reynolds number (Re), δ/length of FPCB (L) and Nusselt number (

บรรณานุกรม :
Lim, Chong Hooi . (2560). Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages.
    กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia.
Lim, Chong Hooi . 2560. "Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages".
    กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia.
Lim, Chong Hooi . "Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages."
    กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia, 2560. Print.
Lim, Chong Hooi . Heat Transfer And Deformation Of Flexible Printed Circuit Board With Multi Ball Grid Array Packages. กรุงเทพมหานคร : Universiti Sains Malaysia, Malaysia; 2560.