ridm@nrct.go.th   ระบบคลังข้อมูลงานวิจัยไทย   รายการโปรดที่คุณเลือกไว้

Tan, Chuan Seng
หน่วยงาน Nanyang Technological University, Singapore
จำนวนงานวิจัยจำแนกรายปี
บุคคลที่เคยร่วมงานวิจัย
ความเชี่ยวชาญ
บุคคลที่เคยร่วมงานวิจัย
# นักวิจัย ร่วมงาน
1 Lim, Dau Fatt 8
2 Peng, L. 6
3 Tan, Yew Heng 6
4 Lee, Kwang Hong 5
5 Fan, Ji 5
6 Zhang, L. 4
7 Gan, Chee Lip 4
8 Leong, K. C. 3
9 Peng, Lan 3
10 Gao, Shan 3
11 Chong, Gang Yih 3
12 Made, Riko I. 3
13 Tan, Cher Ming 2
14 Leong, Kam Chew 2
15 Pey, Kin Leong 2
16 Zhang, Lin 2
17 Ghosh, Kaushik 2
18 Kang, Kitaek 2
19 Ang, Wan Chia 2
20 Hasuike, Noriyuki 2
21 Nishigaki, Hiroshi 2
22 Ueda, Takeshi 2
23 Yoo, Woo Sik 2
24 Xia, Guangrui 2
25 Yu, Siu Fung 2
26 Linfield, Edmund 2
27 Bao, Shuyu 2
28 Yoshimoto, Masahiro 2
29 Harima, Hiroshi 2
30 Zhang, Ying 2
31 Wang, Qi Jie 2
32 Davies, A. Giles 2
33 Khanna, Suraj P. 2
34 Li, Lianhe 2
35 Liang, Houkun 2
36 Liang, Guozhen 2
37 Navab, Singh 1
38 Zhang, Jiye 1
39 Dong, Yuanwei 1
40 Yu, Hao 1
41 Dong, Y. 1
42 Randles, A. B. 1
43 Shang, Yang 1
44 Ling, Joyce H. L. 1
45 Hum, A. J. W. 1
46 Tay, Andrew A. O. 1
47 Wang, Xinpeng 1
48 Li, Xiang 1
49 Chen, Zhixian 1
50 Ng, Wee Loon 1
51 Chua, S. L. 1
52 Aubel, Oliver 1
53 Wee, K. H. 1
54 Yu, H. 1
55 Soe, Oak 1
56 Ee, Yong Chiang 1
57 Tee, Kheng Chok 1
58 Zhao, Xin 1
59 Ang, Diing Shenp 1
60 Yew, Kwang Sing 1
61 Jandl, Adam 1
62 Zhang, Chun 1
63 Lewis, Keith L. 1
64 Hollins, Richard C. 1
65 Rarity, John G. 1
66 Merlet, Thomas J. 1
67 Toet, Alexander 1
68 Lan, Peng 1
69 Dusek, Miloslav 1
70 Gruneisen, Mark T. 1
71 Fitzgerald, Eugene A 1
72 Bao, Shunyu 1
73 Kropelnicki, Piotr 1
74 Narasimhan, Vinayak 1
75 Li, Holden 1
76 Yu, Y. F. 1
77 Zhang, J. B. 1
78 Rusli 1
79 Lai, Donny 1
80 Ang, X. F. 1
81 Wei, J. 1
82 Kwong, Dim Lee 1
83 Jiang, Changyun 1
84 He, Lining 1
85 Bourouina, Tarik 1
86 Ren, M. 1
87 Liu, Ai Qun 1
88 Wang, Hao 1
89 Kropelnicki, P. 1
ปี
# พ.ศ. จำนวน
1 2558 1
2 2557 8
3 2556 6
4 2555 15
5 2554 3
6 2553 1
ผลงานวิจัย
# หัวเรื่อง
ปี พ.ศ. 2558
1 Defects reduction of Ge epitaxial film in a germanium-on-insulator wafer by annealing in oxygen ambient
ปี พ.ศ. 2557
2 Robust electromigration reliability through engineering optimization
3 TSV-less 3D stacking of MEMS and CMOS via low temperature Al-Au direct bonding with simultaneous formation of hermetic seal
4 Detection of Ge and Si intermixing in Ge/Si using multiwavelength micro-raman spectroscopy
5 AlN-AlN wafer bonding and its thermal characteristics
6 Design, simulation and characterization of wheatstone bridge structured metal thin film uncooled microbolometer
7 Monolithic CMOS-MEMS integration for high-g accelerometers
8 Characterization of hetero-epitaxial Ge films on Si using multiwavelength micro-raman spectroscopy
9 Fabrication and characterization of germanium-on-insulator through epitaxy, bonding, and layer transfer
ปี พ.ศ. 2556
10 Single-mode surface-emitting concentric-circular-grating terahertz quantum cascade lasers
11 Effect of direct current stressing to Cu–Cu bond interface imperfection for three dimensional integrated circuits
12 Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation
13 Thermal-reliable 3D clock-tree synthesis considering nonlinear electrical-thermal-coupled TSV model
14 Al2O3 interface engineering of germanium epitaxial layer grown directly on silicon
15 Growth and characterization of germanium epitaxial film on silicon (001) with germane precursor in metal organic chemical vapour deposition (MOCVD) chamber
ปี พ.ศ. 2555
16 Force-induced optical nonlinearity and Kerr-like coefficient in opto-mechanical ring resonators
17 Effects of nanowire texturing on the performance of Si/organic hybrid solar cells fabricated with a 2.2 μm thin-film Si absorber
18 Operating TSV in stable accumulation capacitance region by utilizing Al2O3-induced negative fixed charge
19 Wafer-level hermetic packaging of 3D microsystems with low-temperature Cu-to-Cu thermo-compression bonding and its reliability
20 Novel development of the micro-tensile test at elevated temperature using a test structure with integrated micro-heater
21 Through silicon via fabrication with low-κ dielectric liner and its implications on parasitic capacitance and leakage current
22 Vertical silicon nanowire diode with nickel silicide induced dopant segregation
23 Ultrafine pitch (6-µm) evolution of Cu-Cu bonded interconnects in 3D wafer-on-wafer stacking
24 Single-mode narrow beam divergence surface-emitting concentric-circular-grating terahertz quantum cascade lasers
25 Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief
26 Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
27 Passivation of Cu surface and its application in Cu-Cu bonding for high density 3D IC realization
28 Three-dimensional wafer stacking using Cu–Cu bonding for simultaneous formation of electrical, mechanical, and hermetic bonds
29 Simultaneous formation of electrical connection, mechanical support and hermetic seal with bump-less Cu-Cu bonding for 3D wafer stacking
30 Effect of prebonding anneal on the microstructure evolution and Cu–Cu diffusion bonding quality for three-dimensional integration
ปี พ.ศ. 2554
31 Study of the evolution of Cu-Cu bonding interface imperfection under direct current stressing for three dimensional integrated circuits
32 Growth and characterization of germanium epitaxial film on silicon (001) using reduced pressure chemical vapor deposition
33 Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
ปี พ.ศ. 2553
34 Modeling of electromigration induced contact resistance reduction of Cu-Cu bonded interface