ridm@nrct.go.th   ระบบคลังข้อมูลงานวิจัยไทย   รายการโปรดที่คุณเลือกไว้

Tan, Cher Heng
หน่วยงาน Nanyang Technological University, Singapore
และรู้จักในชื่อของ
- Tan, Cher Ming
จำนวนงานวิจัยจำแนกรายปี
บุคคลที่เคยร่วมงานวิจัย
ความเชี่ยวชาญ
ปี
# พ.ศ. จำนวน
1 2557 1
2 2555 12
3 2554 6
4 2553 2
5 2552 7
6 2551 5
7 2550 1
8 2549 1
9 2548 2
10 2547 1
11 2546 3
12 2545 1
13 2542 2
14 2541 1
ผลงานวิจัย
# หัวเรื่อง
ปี พ.ศ. 2557
1 Damage threshold determination and non-destructive identification of possible failure sites in PIN limiter
ปี พ.ศ. 2555
2 Applications of multi-walled carbon nanotube in electronic packaging
3 Reliability study of LED driver – a case study of black box testing
4 ICMAT 2011 : Reliability and variability of semiconductor devices and ICs
5 Degradation behavior of high power light emitting diode under high frequency switching
6 Integration of low-κ dielectric liner in through silicon via and thermomechanical stress relief
7 Strategy for TSV scaling with consideration on thermo-mechanical stress and acceptable delay
8 Super-resolution in magnetic resonance imaging : a review
9 Effectiveness of reservoir length on electromigration lifetime enhancement for ULSI interconnects with advanced technology nodes
10 Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
11 Effect of Ni-coated carbon nanotubes on interfacial reaction and shear strength of Sn-Ag-Cu solder joints
12 Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
13 3D simulation-based research on the effect of interconnect structures on circuit reliability
ปี พ.ศ. 2554
14 Ensuring accuracy in optical and electrical measurement of ultra-bright LEDs during reliability test
15 Electromigration reliability of interconnections in RF low noise amplifier circuit
16 Effect of IC layout on the reliability of CMOS amplifiers
17 Applications of finite element methods for reliability study of ULSI interconnections
18 Comparison of electromigration simulation in test structure and actual circuit
19 Rapid light output degradation of GaN-based packaged LED in the early stage of humidity test
ปี พ.ศ. 2553
20 Imperfect predictive maintenance model for multi-state systems with multiple failure modes and element failure dependency
21 Interface fracture toughness assessment of solder joints using double cantilever beam test
ปี พ.ศ. 2552
22 Requirement for accurate interconnect temperature measurement for electromigration test
23 Transient electrical thermal analysis of ESD process using 3-D finite element method
24 Effect of Ni-coated carbon nanotubes on interfacial intermetallic layer growth
25 3D circuit model for 3D IC reliability study
26 Going green for discrete power diode manufacturers
27 Comparative study of non-standard power diodes
28 Comparison of stress-induced voiding phenomena in copper line–via structures with different dielectric materials
ปี พ.ศ. 2551
29 Humidity effect on the degradation of packaged ultra-bright white LEDs
30 The multiple temperature heater platforms for solder Electromigration test conducted at room temperature
31 A new creep model for SnAgCu lead-free composite solders : incorporating back stress
32 Fracture toughness assessment of a solder joint using double cantilever beam specimens
33 Statistical modeling of via redundancy effects on interconnect reliability
ปี พ.ศ. 2550
34 A framework to practical predictive maintenance modeling for multi-state systems
ปี พ.ศ. 2549
35 Comparison of medium-vacuum and plasma-activated low-temperature wafer bonding
ปี พ.ศ. 2548
36 Current crowding effect on copper dual damascene via bottom failure for ULSI applications
37 Mathematical model of low-temperature wafer bonding under medium vacuum and its application
ปี พ.ศ. 2547
38 Dynamic study of the physical processes in the intrinsic line electromigration of deep-submicron copper and aluminum interconnects
ปี พ.ศ. 2546
39 Temperature and stress distribution in the SOI structure during fabrication
40 Failure mechanisms of aluminum bondpad peeling during thermosonic bonding
41 Nondestructive void size determination in copper metallization under passivation
ปี พ.ศ. 2545
42 Application of Wigner–Ville distribution in electromigration noise analysis
ปี พ.ศ. 2542
43 Effect of BOE etching time on wire bonding quality
44 Using power diode models for circuit simulations : a comprehensive review
ปี พ.ศ. 2541
45 Failure analysis of bond pad metal peeling using FIB and AFM