ridm@nrct.go.th   ระบบคลังข้อมูลงานวิจัยไทย   รายการโปรดที่คุณเลือกไว้

Leong, K. C.
หน่วยงาน Nanyang Technological University, Singapore
- Ky Leng
- Leong, Kah Wai
# พ.ศ. จำนวน
1 2558 1
2 2557 4
3 2556 4
4 2555 6
5 2554 1
# หัวเรื่อง
ปี พ.ศ. 2558
1 Characterization of the Second Generation Cryopreserved Dendrobium Bobby Messina Using Histological and RAPD Analyses
ปี พ.ศ. 2557
2 Realization of write-once-read-many-times memory device with O2 plasma-treated indium gallium zinc oxide thin film
3 Influence of localized surface plasmon resonance and free electrons on the optical properties of ultrathin Au films : a study of the aggregation effect
4 A study on the evolution of dielectric function of ZnO thin films with decreasing film thickness
5 Uncooled resonant infrared detector based on aluminum nitride piezoelectric film through charge generations and lattice absorptions
ปี พ.ศ. 2556
6 Effects of free electrons and quantum confinement in ultrathin ZnO films : a comparison between undoped and Al-doped ZnO
7 Effect of exposure to ultraviolet-activated oxygen on the electrical characteristics of amorphous indium gallium zinc oxide thin film transistors
8 Cu–Cu hermetic seal enhancement using self-assembled monolayer passivation
9 Recovery from ultraviolet-induced threshold voltage shift in indium gallium zinc oxide thin film transistors by positive gate bias
ปี พ.ศ. 2555
10 Correlation between oxide trap generation and negative-bias temperature instability.
11 Novel development of the micro-tensile test at elevated temperature using a test structure with integrated micro-heater
12 The role of graphite foam pore structure on saturated pool boiling enhancement.
13 Are interface state generation and positive oxide charge trapping under negative-bias temperature stressing correlated or coupled?
14 Effect of nickel silicide induced dopant segregation on vertical silicon nanowire diode performance
15 Seismic shear demand of a medium-rise building designed by response spectrum analysis
ปี พ.ศ. 2554
16 Low temperature Cu-Cu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement